Copper Wire Bonding
| Author | : | |
| Rating | : | 4.71 (857 Votes) |
| Asin | : | 1461457602 |
| Format Type | : | paperback |
| Number of Pages | : | 235 Pages |
| Publish Date | : | 2013-04-25 |
| Language | : | English |
DESCRIPTION:
Preeti Chauhan is a researcher from the Center for Advanced Life Cycle Engineering at the University of Maryland. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland.. She is currently a technology development Q&R engineer at Intel Corporation.Anupam Choubey is a consultant in the area of packaging engineering in the Boston, MA area. ZhaoWei Zhong is a Professor of Mechanical and Aerospace Engineering at Nany
In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. However, copper wire bonding has several process and reliability concerns due to its material properties. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changesbond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components.In summary, this book:Introduces copper wire bonding technologiesPresents copper wire bonding processesDiscusses copper wire bonding metallurgiesCovers recent advanc
"Copper Wire Bonding" according to Cliff Schuring. Good book was hoping for a little more information, but better that anything else I have. Hope to see a more detailed book on this in the very near future, and a lot more information on coated copper wires.
From the reviews:“The book gives a wide perspective on the technical insights of copper wire bonding deployment in industry while adding very valuable industry insights. Valuable as a learning tool for copper wire bonding, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan, Classe Francis, Bak Lee Chan and Hashim Uda, Microelectronics Reliability, November, 2013). It is a good resource to demonstrate the many facets of copper wire bonding, and can serve as a very informative technical reference