Chemical Mechanical Planarization of Semiconductor Materials
| Author | : | |
| Rating | : | 4.47 (505 Votes) |
| Asin | : | 3540431810 |
| Format Type | : | paperback |
| Number of Pages | : | 428 Pages |
| Publish Date | : | 2016-01-13 |
| Language | : | English |
DESCRIPTION:
The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. From the Back Cover This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. The state of polishing models and their relation to experimental results are covered. . Polishing tools and consumables are also covered. There are detailed discussions of all aspects of the technology, for both dielectrics and metals
"CMP: An Overview" according to Amazon Customer. This is an outstanding book. It provides an overview of the current status of CMP and serves as a significant update to Steigerwald's 1997 book, which summarized the state of CMP knowledge (which began for electronic applications in 1991)at that time. Much has happened in the . Nice book The book arrived on time. This book is new and there is no mark on this book. That's what I want. Awesome.
The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.. This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. Polishing tools and consumables are also covered. The state of polishing models and their relation to experimental results are covered. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals